HW-Largo (Hexagonal) – Metallographic fine grinding disc, available with diamond, alumina, silicon carbide, or cerium oxide abrasives; custom sizes available.

HW-Largo (Hexagonal) – Metallographic fine grinding disc Product features ☑️ Reduce process / Combined back-end grinding and front-end polishing, enhancing work efficiency. ☑️ Highly efficient / Flexible backing plus high quality abrasives, small residual scratch on the cut surface, improving subsequent polishing quality. ☑️ Widely applicable / Soft fine grinding discs are available with different abrasive types and grit sizes, suitable for workpieces of varying hardness. ☑️ High Flatness / Uniformly fine grinds both soft and hard materials, preventing rounding or chamfering, and ensuring sample consistency. ☑️ High Quality and Efficiency / Grid pattern reduces debris accumulation, provides consistent high removal rate, and ensures cross-sectional flatness.   Application areas: Materials science, metal identification, failure analysis, manufacturing, materials research and development, diamond and gemstone processing, electronics and semiconductor industries. Copper-clad laminates, double-sided grinders, and single-disc grinders. Product features Abrasive Particle size(um) Size(mm) Size(in) Diamond 0.5 1.0 2.0 3.0 6.0 9.0 Ø127 Ø200 Ø220 Ø230 Ø250 Ø300 Ø350 Ø380   Ø5 Ø8 Ø8.6 Ø9 Ø9.5 Ø12 Ø14 Ø15   Aluminum Oxide Silicon carbide Cerium Oxide 0.5 1.0 2.0 3.0     1. Product differences Metallographic fine grinding disc Metallographic grinding disc Abrasive layer soft hard Shore hardness 80 degrees 90 degrees Introduction Soft as cowhide Hard as steel Application Replaces the three processes of back-end grinding and front-end polishing Replaces sandpaper for grinding super-hard materials 2. How to Choose How to choose abrasives: The specific application depends on the hardness of the workpiece material and your current actual process. like: Diamond: super cemented carbide, electronic materials, ceramics. Aluminum oxide: soft metal, plastic, glass, IC substrate, packaging materials, semiconductors and various electronic parts, printed circuit boards (PCB) and connectors. Silicon Carbide (SiC): Suitable for semiconductor materials (such as silicon wafers and gallium arsenide), electronic materials, superhard metals, ceramics, glass, and gemstones. Cerium Oxide (CeO₂): Used for optical glass (lenses, prisms, and other optical components), gemstones, ceramics, semiconductors (such as wafers), and cubic zirconia. (Note: The above applications are for reference only. The specific use should depend on the hardness of the workpiece material and your current process requirements.) Grit size selection: The 3.0um (4000#) fine grinding disk facilitates a seamless progression from a preceding 6.0um (2400#) grinding stage to a subsequent 1.0um polishing stage, followed by a final, precision polishing step using a polishing cloth devoid of polishing slurry. Usage instructions: Simply place the fine grinding disc directly onto the magnetic machine plate. No polishing cloth or additional abrasives (polishing liquid) are needed; you can begin fine grinding using tap water. 3. Precautions For optimal flatness, avoid sticking any labels or similar items to the bottom of the disc to prevent affecting workpiece flatness. Ensure that the contact surface between the grinding disc and the machine is very flat, clean, and dry to avoid impacting the workpiece’s flatness. After use, carefully remove the pad, rinse with water, and let it air dry. Avoid bending or damaging the precision grinding disc. When installing or removing, do so carefully to avoid magnetic attraction pinching your hands. 4. Other options