Chamfering and Grinding Wheels for Silicon Wafers Honway Materials provide customized services, Manufacturing the most suitable chamfering and grinding wheels for your silicon and sapphire wafers. High-performance grinding wheels specifically designed for chamfering and grinding semiconductor material substrates, featuring a uniform and fine abrasive grain layer structure and manufactured using high-precision finishing technology. After dressing, they exhibit a low defect rate, excellent quality, and superior machining accuracy. The product line covers standard grinding wheels suitable for outer periphery and groove processing, and offers three grinding wheel styles: single-groove type, multi-groove type, and rough/fine mixed type, to meet various processing needs. Product Features: Possess excellent shape retention, meeting the strict requirements for high precision and stability in silicon wafer chamfering. Adopt a metal bond design, effectively enhancing wear resistance and significantly extending service life, reducing replacement frequency. Maintain stable grinding performance even under long-term operation, ensuring consistent and stable machining quality. Single or multi-groove designs can be provided according to customer needs, and rough and fine grinding functions can be integrated into one wheel to meet different process conditions. Combining the advantages of long lifespan, low dressing frequency, and stable machining capability, helping to reduce overall processing costs. Uses: Mostly metal bond grinding wheels and electroplated bond grinding wheels. Chamfering and grinding of silicon wafers and compound semiconductors. Compatible with the latest equipment from several representative wafer chamfering machine manufacturers, ensuring high compatibility and stable machining performance. Application areas: Grinding wheels for chamfering and grinding semiconductor material substrates. Suitable for various types of processing such as V-shaped, R-shaped, single-groove, or continuous groove. Please specify the following when ordering grinding wheels. The shape of the grinding wheel and the dimensions of each part: such as1A1、14A1 Abrasive type: Diamond Grit: e.g:#150 Concentration: e.g:C-75 Bond type: For example, electroplated bond or metal bond Grinding wheel style: Single-groove type, multi-groove type, and rough/fine mixed type Use: For silicon wafers, sapphire wafers Quantity and delivery time: RPM and processing conditions: Processing equipment model: Most manufacturers label their grinding wheels with the following information: Abrasive Type 150 Grit N Bonding degree 75 Concentration R Bond 3.0 Abrasive layer thickness D: Natural Diamonds SD: Artifitial Diamonds #60 #80 #100 #150 #200 #270 #325 #400 #600 J / Soft L N P R / Hard 25 50 75 100 125 150 M: Metal bond P: Electroplated 1.0mm 1.5mm 2.0mm 3.0mm 5.0mm 10.0mm Sample pictures Any questions? Contact HonWay
