Diamond Substrate/Diamond Wafer

Diamond Substrate/Diamond Wafer Diamond Substrate/Diamond Wafer Honway Materials provide customized services, Manufacturing the most suitable diamond substrate/diamond wafer for you.   Product Features: CVD diamond is manufactured using the Chemical Vapor Deposition method. Diamond possesses the highest thermal conductivity among all known materials, enabling effective and rapid heat dissipation. Possesses excellent wear resistance and damage resistance. Suitable for various high-durability applications, including precision cutting tools, industrial saw blades, and drilling equipment. Exhibits high transparency and low absorption across a broad wavelength range, making it an ideal material for optical windows, lenses, and high-performance optical components. Highly resistant to corrosion from acids, alkalis, and most chemical substances, maintaining stable performance for extended periods even in harsh chemical environments. Non-toxic and does not cause rejection reactions with human tissues, widely used in medical devices and implantable devices. Application areas: Thermal Interface Materials (TIMs): Diamond wafers can be used as high-efficiency thermal interface materials between chips, modules, and heat sinks, effectively reducing thermal resistance, significantly improving thermal conductivity efficiency, and ensuring stable equipment operation. Electronic Packaging and Substrates: In the semiconductor packaging field, diamond wafers provide excellent heat dissipation performance, supporting continuous operation of components in high power density environments, further promoting the miniaturization and high performance of electronic products. Server Applications: Can serve as an ideal heat spreader for high-power components such as GaN or SiC crystals, effectively reducing internal temperature rise, extending component lifespan, and improving system reliability. In addition, its excellent mechanical strength and high-temperature resistance are also very suitable for advanced packaging technologies such as 2.5D/3D stacking and high-performance computing platforms in data centers. LED and Optoelectronic Components: Applied in fields such as LEDs and optoelectronic components, diamond wafers can significantly improve thermal management, extend component lifespan, and enhance luminous brightness and energy efficiency, meeting the demands of high-end optoelectronic applications. Insulation Substrates: CVD diamond wafers are used as insulation substrates for high-performance semiconductors. Their electrical insulation and high thermal conductivity make them ideal for power devices and RF (radio frequency) components. Medical Devices: Industrial-grade diamonds are also used in some medical fields, such as high-precision surgical instruments and dental drills. Due to diamond’s high hardness and wear resistance, it can improve the service life and accuracy of medical devices. Product Specification: Grade Optical Grade Heat sink grade Diamond Type Monocrystalline Polycrystalline Wafer size Maximum 15*15mm², customizable 2 inches, customizable Grit size ≤10μm Diameter tolerance ﹢0.1, -0mm ﹢0.1, -0mm Thickness 0.3-1.5mm Thickness after polishing 0.1~2mm 0.2-1.0mm Thickness tolerance ±0.02mm≤10mm ±0.03mm, 10~15mm ±50μm Crystallographic direction 100 Surfaece treatment- Polishing, Ra<2nm Growth surface roughness <100nm Ra Nucleation surface roughness <30nm Ra Standard thickness 300μm ※ If you have any customized needs, please contact Honway Physical Properties: Grade Optical Grade Heat sink grade Diamond Type Monocrystalline Polycrystalline Density 3.52 g/cm3 3.52 g/cm3 Raman full width at half maximum (FWHM) ~2.1 cm⁻¹ Nitrogen concentration <0.5 ppm Thermal conductivity 1900~2200 W/(m·K) 300K 1200~2000 W/(m·K) 300K Transmittance >70% 1064 nm Refractive Index 2.379 @ 10.6 um Young’s modulus 850GPa Chemical stability Insoluble in all acids and bases Breaking strength 350GPa Parallelism <4μm/cm   Diamond Specifications Comparison: Monocrystalline CVD Diamond Wafer Polycrystalline CVD Diamond Wafer Structure Single, continuous crystal structure Multiple randomly oriented small crystals Mechanical properties Excellent hardness, strength and wear resistance Low strength, affected by grain boundaries Thermal conductivity Higher, excellent heat dissipation performance Lower (due to grain boundaries) Optical properties Exceptional optical clarity and precision Low clarity, may have flaws Electrical properties Highly controllable, direction dependent High isotropy, low controllability Application Electronics, optics, high performance applications Industrial tools, radiators, abrasives, heat dissipation materials   Performance comparison of diamond and other common infrared materials: Physical Properties Unit Diamond ZnSe ZnS Ge Si GaAs Al₂O₃ Band gap eV 5.48 2.7 3.9 0.664 1.11 1.42 9.9 Cut-off wavelength μm 20 14 23 5.5 Absorption coefficient 0.1~0.3 0.005 0.2 0.02 0.35 0.01 Absorption coefficient 10.6 μm 0.1~0.6 0.0005 0.2 0.02 Microhardness kg/mm² 8300 137 230 780 1150 721 190 Refractive index 2.38 2.40 2.19 4.00 3.42 3.28 1.63 dn/dT 10⁻³/K 1.0 6.4 4.1 40 13 15 1.3 Thermal conductivity W/(cm·K) 18~22 0.19 0.27 0.59 1.63 0.55 0.35 Coefficient of thermal expansion 10⁻⁶K⁻¹ Optical Grade 1.3 7.6 7.9 5.9 2.56 5.9 5.8 Heat sink grade 0.8~1.0   Any questions? 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